Process and device for the spatially resolved localization of defects in materials

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United States of America Patent

APP PUB NO 20240328973A1
SERIAL NO

18576520

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Abstract

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A novel process allows defects in materials, in particular in solid bodies (18), to be localized with considerably higher spatial resolution than before. Defects can be quickly and economically imaged with high spatial resolution. It is possible to contactlessly spin-selectively excite and capture or image defects in the solid body with high sensitivity, high dynamic range, large field of view and excellent resolution, which far exceeds the present capabilities of optical detection processes. Furthermore, with the process there is an excellent possibility for detecting spin even in individual images, wherein high contrast of the spin states and better fidelity of reproduction of the spin states are made possible. The device (10) and the process are suitable for quantum calculation using defect spins in solid bodies (18), for quantum-capable capturing and for quantum-capable measurement networks.

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Patent Owner(s)

Patent OwnerAddress
ARUMUGAM SRI RANJINILEIPZIG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ARUMUGAM, Sri Ranjini Leipzig, DE 1 0

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