Importance

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Abstract

An object of the present invention is to provide a dry ice cleaning apparatus for a semiconductor wafer and a method for cleaning a semiconductor wafer that can reduce the amount of particles remaining on the surface of a semiconductor wafer, suppress a decrease of cleaning effects due to ice formation, and continuously and effectively clean a large amount of semiconductor wafers. The present invention provides a dry ice cleaning apparatus for a semiconductor wafer including a cleaning chamber (1) into which the semiconductor wafers (W) are sequentially carried in and which has an internal space (11) for cleaning the semiconductor wafers (W), an inject cleaning nozzle (5) that is disposed in the internal space (11) of the cleaning chamber (1) and injects the dry ice (D) toward the cleaning surface of the semiconductor wafer (w), and a transfer robot (2) that is disposed in the internal space (11) of the cleaning chamber (1) and sequentially carries the semiconductor wafers (W) from the outside of the cleaning chamber (1) into the internal space (11); and wherein while the transfer robot (2) holding the semiconductor wafer (W) carried into the internal space (11) non-horizontally, the inject cleaning nozzle (5) injects the dry ice (D) onto the semiconductor wafer (W).

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First Claim