RADIO FREQUENCY (RF) CONDUCTIVE MEDIUM
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United States of America Patent
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Oct 3, 2024
app pub date -
Apr 3, 2024
filing date -
May 1, 2012
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Abstract
Embodiments of the present disclosure provide a radio frequency (RF) conductive medium for reducing the undesirable insertion loss of all RF hardware components and improving the Q factor or “quality factor” of RF resonant cavities. The RF conductive medium decreases the insertion loss of the RF device by including one or more conductive pathways in a transverse electromagnetic axis that are immune to skin effect loss and, by extension, are substantially free from resistance to the conduction of RF energy.
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