Preparation of High Molecular Weight Polymers with Minimal Gel Content

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United States of America Patent

APP PUB NO 20240343944A1
SERIAL NO

18688511

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Abstract

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Curable precursor compositions for adhesives (e.g., pressure sensitive adhesives) and related articles, assemblies, and methods. The provided compositions contain a mixture comprising 50 to 100 parts by weight of a first polymerizable component, 0 to 50 parts by weight of a second polymerizable component, a transition metal complex soluble in the mixture, and an effective amount of a polymerization initiator, thereby allowing for the formation of high molecular weight polymer with essentially no gel content that can be easily processed via established hot melt techniques (i.e., a hot melt processable adhesive), even in the absence of chain transfer agents or crosslinking agents.

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Patent Owner(s)

Patent OwnerAddress
3M INNOVATIVE PROPERTIES COMPANYPO BOX 33427 ST PAUL MN 55133-3427

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kellen, Barbara L Baldwin, US 2 0
Kugel, Alexander J Woodbury, US 46 127
Prince, Ryan B St. Paul, US 29 728
Wohl, Adam R Mahtomedi, US 8 13

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