POWER MODULE
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
Sep 27, 2023
filing date -
Sep 27, 2023
priority date (Note) -
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Abstract
A power module includes a first substrate and a second substrate; a semiconductor chip; a resistor electrically connecting the first substrate and the second substrate while being spaced from the semiconductor chip in the horizontal direction, the resistor including a resistance value greater than a resistance value of the metal layer; a first sensing lead connected to a first end portion of the resistor; and a second sensing lead connected to a second end portion of the resistor.
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