ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGANIC INTERFACES
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United States of America Patent
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Issued Date -
Oct 24, 2024
app pub date -
Aug 10, 2023
filing date -
Aug 10, 2023
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Abstract
An electronic device having a substrate with a metal structure, a mono-layer coating of a selected silane composition on a surface of the metal structure, and an organic layer on the mono-layer coating, wherein the mono-layer coating improves the interfacial adhesion strength between the metal surface and the organic material.
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