HEAT STABLE BARRIER FILM STRUCTURE
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Feb 11, 2022
filing date -
Feb 11, 2022
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Abstract
This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 μm to 100 μm, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude in the range of from 0.25 μm to 1.0 μm and a wavelength in the range of from 2 μm to 5 μm. Also disclosed are packages (e.g., hermetically sealed packages) formed from the barrier packaging film.
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