METHOD FOR FORMING A BOND BETWEEN TWO SUBSTRATES OF A DEVICE; DEVICE OBTAINABLE BY THE METHOD; A MICROFLUIDIC DEVICE; AND USE OF THE DEVICE
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Mar 21, 2022
filing date -
Mar 21, 2022
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Abstract
A method for forming a bond between substrates of a device includes providing first and second substrates, providing a first functionalized polyelectrolyte polymer (A) and providing a second functionalized polyelectrolyte polymer (B). Forming a functionalized surface on an exposed surface of the first substrate having the first functionalized polyelectrolyte polymer (A) attached thereto, forming a functionalized surface on an exposed surface of the second substrate having the second functionalized polyelectrolyte polymer (B) attached thereto, contacting at least a part of the functionalized surface of the first substrate onto at least a part of the functionalized surface of the second substrate thereby forming a contact area between the first functionalized polyelectrolyte polymer (A) and the second functionalized polyelectrolyte polymer (B), and forming a covalent bond between a first coupling moiety (A1) and a second coupling moiety (B1) in the contact area between the first and second substrates for binding the substrates.
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