Importance

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Abstract

Manufacturers, particularly manufacturers of parts for aerospace applications, may use a plating mask to mask parts when plating. Plating masks may be used to mask a metallic part during etching and plating. After etching and plating, the plating mask needs to be removed. The present disclosure describes a solvent blend for removing a plating mask that comprises a co-solvent and a vapor phase cleaning solvent, wherein the co-solvent has a higher boiling point than the vapor phase cleaning solvent. In some embodiments, the co-solvent comprises isopropyl myristate. In some embodiments, the vapor phase cleaning solvent comprises a mixture of trans-1,2-dichloroethylene and hydrofluoroether.

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First Claim