PLATING MATERIAL, AND TERMINAL-EQUIPPED ELECTRIC WIRE, CONNECTOR, AND WIRE HARNESS USING THE SAME
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Apr 25, 2024
filing date -
Apr 25, 2024
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Abstract
A plating material includes a metal base material and a silver-tin alloy plating layer being arranged on the metal base material and containing a silver-tin alloy. Further, the silver-tin alloy plating layer contains crystal grains of Ag3Sn, and a ratio of grains of Sn per observed area is equal to or greater than 2.0% and equal to or less than 11.0% when the crystal grains of Ag3Sn are arranged isotropically, and a cross-section of the silver-tin alloy plating layer is observed with an FE-SEM.
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