SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Apr 24, 2024
filing date -
Apr 24, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
This invention is directed to substrate processing techniques for performing a chemical liquid processing, a cleaning process, or the like on a substrate. In this invention, while the substrate is processed with the processing liquid, liquid droplets of the processing liquid scattered from the substrate are collected by an inner peripheral surface of a cup. After this processing and before the cup is elevated to a cup elevation position, a heated gas is supplied to the inner peripheral surface of the cup via an upper surface of the substrate while the cup is rotated. Thus, the cup is dried by the rotation of the cup and the supply of the heated gas to the cup.
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