Importance

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Abstract

A method for manufacturing a conductive circuit board includes the steps of: preparing a substrate having opposite upper and lower surfaces, and at least one via hole extending through the upper and lower surfaces and defined by an inner surface; forming a compound metal layer on at least one of the upper surface and the lower surface of the substrate and on the inner surface; etching the compound metal layer by a laser beam, so that a patterned metal circuit layer having a predetermined pattern formed on the substrate; and forming a surface finish layer on a top surface of the patterned metal circuit layer, so as to form a conductive circuit layer. A conductive circuit board manufactured therefrom is also enclosed.

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First Claim