SENSING DEVICE AND PREPARATION METHOD THEREFOR
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United States of America
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Issued Date -
Oct 31, 2024
app pub date -
Aug 10, 2022
filing date -
Aug 10, 2022
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Abstract
A method for preparing a sensing device is provided, the method includes: forming, on a surface of a transparent substrate, a first auxiliary patterning layer having a trench; and forming a mesh structure in the trench of the first auxiliary patterning layer by means of an electroplating process, or forming a conductive layer in the trench of the first auxiliary patterning layer by means of an electroplating process and then etching the conductive layer to form a mesh structure. The mesh structure has a line width of less than or equal to 1.5 microns and a thickness of greater than or equal to 2 microns.
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