COPPER FINE PARTICLE DISPERSION

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240367225A1
SERIAL NO

18293444

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A copper fine particle dispersion including copper nanoparticles A dispersed in the copper fine particle dispersion with a polymer B, and a dispersion medium C. The polymer B contains a constitutional unit derived from a carboxy group-containing monomer (b-1) and a polyalkylene glycol segment-containing monomer (b-2). A content of the polyalkylene glycol segment in the polymer B is not less than 55% by mass and not more than 97% by mass. An acid value of the polymer B is not less than 20 mgKOH/g and not more than 250 mgKOH/g. The dispersion medium C includes at least one compound selected from the group consisting of a (poly)alkylene glycol, a (poly)alkylene glycol derivative, a terpene alcohol, glycerin and a glycerin derivative.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
KAO CORPORATIONTOKYO 103-8210

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
EYAMA, Takaaki Wakayama-shi, JP 2 0
TAKIGUCHI, Osamu Wakayama-shi, JP 27 188
YOSHIDA, Tomohide Wakayama-shi, JP 27 420

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation