ULTRAVIOLET-CURABLE HEAT-DISSIPATING RESIN COMPOSITION, HEAT-DISSIPATING PRESSURE-SENSITIVE ADHESIVE SHEET, LAYERED PRODUCT, AND METHOD FOR PRODUCING LAYERED PRODUCT
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
May 30, 2022
filing date -
May 30, 2022
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Abstract
The present invention aims to provide a UV-curable heat-dissipating resin composition having excellent printability, excellent heat dissipation properties, and excellent adhesion to various substrates. The present invention also aims to provide a heat-dissipating adhesive sheet containing the UV-curable heat-dissipating resin composition, a laminate, and a method for producing a laminate. Provided is a UV-curable heat-dissipating resin composition containing: (A) a nitrogen-containing monomer; (B) a monofunctional (meth) acrylate monomer; (C) a crosslinking component; (D) a photopolymerization initiator; and (E) a thermally conductive filler having a thermal conductivity of 3 W/m·K or higher, the thermally conductive filler (E) being contained in an amount of 20 to 70% by volume, the nitrogen-containing monomer (A) being contained in an amount of 10 to 35% by weight relative to a whole amount of the composition excluding the thermally conductive filler (E).
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