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Abstract

Low stress and tailorable stress adhesives for bonding of sensitive components and a process for using the same are disclosed. The residual curing stress is tailorable based on adherends and with material properties that minimize environmentally induced thermal and hygroscopic distortions. Degraded performance of sensitive optical assemblies may be reduced or eliminated during bonding processes due to residual stress formation of adhesives. The adhesives are characterized by a second mechanism of stress formation other than the tensile stress from shrinkage during curing. Specifically, the adhesive is characterized by a cure gradient through its thickness, causing diffusion of uncured monomer into the more highly crosslinked region. This diffusion causes a compressive stress to form and offset the tensile cure shrinkage stress. The relative amounts of shrinkage and swelling that occur can be tailored to control residual stress formation, and ultimately, to generate a zero-stress bonding adhesive.

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First Claim