METHOD FOR WASHING SUBSTRATE TREATMENT APPARATUS
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United States of America
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Nov 7, 2024
app pub date -
Sep 20, 2022
filing date -
Sep 20, 2022
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Abstract
Provided is a method for cleaning a substrate processing apparatus. The method includes loading a substrate into a chamber, injecting a gas containing at least one of Zn, Ga, In, or Sn into the chamber to deposit a thin film on the substrate, unloading the substrate to the outside of the chamber, injecting a cleaning gas containing Br into the chamber, and exhausting byproducts generated through a reaction between impurities deposited inside the chamber in addition to the substrate and the cleaning gas in the depositing of the thin film. Therefore, the inside of the apparatus may be cleaned at relatively low temperature. That is, impurities having the form of the thin film, which are deposited on a surface of a component or structure installed inside the apparatus may be delaminated from the surface.
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