Importance

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Abstract

A wafer cleaning system is provided, including pins configured to support a wafer; a brush element including a brush holder movable relative to the wafer, and a brush head configured to rotate on the brush holder; a control device configured to control the brush element; an inspection device configured to inspect the backside of the wafer and generate an inspection signal; and a process module configured to generate a control signal according to the inspection signal, wherein the control signal includes movement information of the brush element according to coordinates of the contaminants obtained from the inspection signal, wherein control device is configured to control the brush element to clean the backside of the wafer along a first path according to the control signal when the wafer is disposed on the pins.

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First Claim