WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
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United States of America
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Issued Date -
Nov 7, 2024
app pub date -
Jul 22, 2024
filing date -
Jul 22, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring board including a first resin layer, wiring patterns arranged on at least one surface of the first resin layer, and a second resin layer disposed between the wiring patterns and on the wiring patterns, in which, in a cross section along a thickness direction, an interface roughness Rz1 of an interface between the first resin layer and the second resin layer is larger than an interface roughness Rz2 of an interface between the first resin layer and the wiring pattern; and applications thereof are provided.
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