PHOTOSENSITIVE RESIN PRINTING PLATE PRECURSOR FOR RELIEF PRINTING, AND PRINTING PLATE
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United States of America
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Issued Date -
Nov 14, 2024
app pub date -
Sep 26, 2022
filing date -
Sep 26, 2022
priority date (Note) -
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Abstract
A photosensitive resin printing plate precursor is disclosed for relief printing, including a support, a photosensitive resin layer, and a cover film stacked in this order, wherein the photosensitive resin layer comprises a lower layer present on a support side and an upper layer present on a cover-film side, wherein the upper layer is a photosensitive resin layer that contains a water-soluble or water-dispersible resin (A) having a glass transition temperature measured by differential scanning calorimeter of 40 to 90° C., wherein the upper layer has a thickness of 3 to 30 micrometers, wherein the lower layer is a layer that contains a water-soluble or water-dispersible resin (B) having a glass transition temperature higher than the glass transition temperature of the water-soluble or water-dispersible resin (A) by 5° C. or more, and wherein the glass transition temperature of the resin (B) measured by differential scanning calorimeter is 95 to 135° C.
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