TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD
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United States of America
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Issued Date -
Nov 14, 2024
app pub date -
May 8, 2023
filing date -
May 8, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a printed circuit board (PCB) includes arranging a first trace segment of a trace on a substrate of the PCB, the substrate being composed of fiber glass strands that define a fiber glass weave pattern, and arranging a second trace segment of the trace on the substrate at a position that is fractionally offset from the first trace segment along an axis by a distance that is less than a ball grid array (BGA) pitch of a BGA based on the fiber glass weave pattern. The BGA pitch is a separation distance along the axis between a center of a first via of the BGA of the PCB and a center of a second via of the BGA.
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