CONDITIONING CHAMBER COMPONENT
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Nov 21, 2024
app pub date -
Jul 29, 2024
filing date -
Jul 29, 2024
priority date (Note) -
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Abstract
A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.
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