Importance

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Abstract

An object of the present invention is to provide a conductive paste that can form a conductive film with excellent conductivity and that does not easily scatter copper fine particles even when sintered with irradiation energy that can sufficiently remove a binder resin, a conductive film-coated film using the conductive paste, and a method for producing a conductive film-coated substrate. The present invention provides a conductive paste containing copper fine particles with an average particle size of 300 nm or less, copper coarse particles with an average particle size of 3 to 11 μm, a binder resin, and a dispersion medium, wherein a content of the binder resin is 0.1 to 2.0 parts by mass with respect to a total of 100 parts by mass of the copper fine particles and the copper coarse particles; a conductive film-coated substrate including a substrate and a sintered body of the conductive paste provided on the substrate; and a method for producing a conductive film-coated substrate including providing a film containing the conductive paste a substrate; and applying a sintering treatment to the film.

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First Claim