ADHESIVE KIT, ADHESION METHOD, AND ADHERED STRUCTURE

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United States of America

APP PUB NO 20240384144A1
SERIAL NO

18696565

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Abstract

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An adhesive kit includes: an adhesive layer containing an epoxy resin and an elastomer; and a curing agent liquid composition capable of curing the adhesive layer by contact and a reaction with the adhesive layer, in which the adhesive layer contains 1 mass % to 30 mass % of the elastomer.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONIBARAKI-SHI OSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SUZUKI, Yuto Ibaraki-shi, Osaka, JP 83 329
TANAKA, Akiko Ibaraki-shi, Osaka, JP 96 571

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