LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240384394A1
SERIAL NO

18785197

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Abstract

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Provided is a low carbon defect copper-manganese (CuMn) sputtering target and systems and methods for producing the same. The low carbon defect CuMn sputtering target may comprise of copper with a purity of at least about 99.9999%, manganese with a purity of about 99.9% to about 99.999%, and one or more active elements comprising of oxygen (O) at about 100 parts per million (ppm) to about 4000 ppm, iron (Fe) at about 5 parts per billion (ppb) to about 100 ppm, sulfur(S) at about 5 ppm to about 400 ppm, hydrogen (H) at about 1 ppm to about 10 ppm, and chromium (Cr) at about 5 ppb to about 200 ppm, wherein the manganese has a compositional range of up to about 5 wt %.

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Patent Owner(s)

Patent OwnerAddress
TOSOH SMD INCGROVE CITY OH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
del, Rio Perez Eduardo Dublin, US 3 0
Theado, Erich Walter Columbus, US 3 0
Thrun, Lora Birkefeld Grove City, US 3 0

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