CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE
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United States of America
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Nov 28, 2024
app pub date -
Jul 31, 2024
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Jul 31, 2024
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Abstract
Methods of manufacturing a chemical-mechanical polishing (CMP) slurry and methods of performing CMP process on a substrate comprising metal features are described herein. The CMP slurry may be manufactured using a balanced concentration ratio of chelator additives to inhibitor additives, the ratio being determined based on an electro potential (Ev) value of a metal material of the substrate. The CMP process may be performed on the substrate based on the balanced concentration ratio of chelator additives to inhibitor additives of the CMP slurry.
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