BONDING STRUCTURE AND METHOD OF FORMING SAME
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United States of America
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Issued Date -
Nov 28, 2024
app pub date -
Jul 31, 2024
filing date -
Jul 31, 2024
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Abstract
A device includes an interconnect structure over a substrate, multiple first conductive pads over and connected to the interconnect structure, a planarization stop layer extending over the sidewalls and top surfaces of the first conductive pads of the multiple first conductive pads, a surface dielectric layer extending over the planarization stop layer, and multiple first bonding pads within the surface dielectric layer and connected to the multiple first conductive pads.
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