TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL MATERIAL
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United States of America
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Issued Date -
Nov 28, 2024
app pub date -
Aug 31, 2022
filing date -
Aug 31, 2022
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Abstract
A terminal material having a plating film which can be used as a terminal for electric connection and a contact for a connector, including a base material made of copper or copper alloy and a plating film formed on the base material; the plating film has a tin layer made of tin or tin alloy; a surface-part KAM value measured by analyzing a cross section of a surface part by the EBSD method in a range of depth 1 μm in a thickness direction of the base material from an interface between the base material and the plating film is 0.15° or more and less than 90°; and a center-part KAM value in a center part of a plate thickness of the base material is 0.1 times or more and 0.6 times or less of the surface-part KAM value.
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