WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
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United States of America
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Issued Date -
Nov 28, 2024
app pub date -
May 8, 2024
filing date -
May 8, 2024
priority date (Note) -
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Abstract
A wiring circuit board includes a first insulating layer, a wiring pattern disposed at one side of the first insulating layer in a thickness direction and including a terminal and a wire connected with the terminal, and a shield pattern disposed at the one side of the first insulating layer in the thickness direction and spaced apart from and adjacent to a part of the wire. The wire is made of a first conductive layer, and the shield pattern is made of a second conductive layer.
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