HEAT DISSIPATION MATERIAL AND ELECTRONIC DEVICE
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United States of America
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Issued Date -
Dec 5, 2024
app pub date -
Sep 22, 2022
filing date -
Sep 22, 2022
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Abstract
A heat dissipation material that has insulating properties and uses spherical fillers includes at least one of a filler having a particle size of 200 μm or more and 1000 μm or less and having a ratio of 20% or more and a filler having a particle size of 1 nm or more and 10 μm or less and having a ratio of 20% or more, with respect to the total amount of the fillers.
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