THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER
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United States of America
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Dec 5, 2024
app pub date -
Sep 28, 2022
filing date -
Sep 28, 2022
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Abstract
A thermally conductive composition of the present invention is a composition in a liquid form at 25° C. comprising an organopolysiloxane, a thermally conductive filler, and an ester compound having 12 to 28 carbon atoms. According to the present invention, it is possible to provide a thermally conductive composition, which has good workability because of its low viscosity, excellent heat resistance, and in which a low-molecular weight siloxane does not tend to be generated.
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