WET CLEANING METHOD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 5, 2024
app pub date -
Jul 31, 2024
filing date -
Jul 31, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A method includes: placing a semiconductor wafer in a chamber during a semiconductor fabrication process; providing a semiconductor cleaning apparatus, the semiconductor cleaning apparatus comprising: a first inlet configured to receive a carrier gas; a gas passageway connected to the first inlet; a second inlet configured to receive one or more fluids; and a fluid passageway connected to the second inlet; delivering the carrier gas from the first inlet to the at least one gas passage branch through the gas passageway; spraying the carrier gas onto the semiconductor wafer; delivering the one or more fluids from the second inlet to the at least one fluid passage branch through the fluid passageway; and spraying the one or more fluids onto the semiconductor wafer.
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