WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVIDED WITH WIRING BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 5, 2024
app pub date -
Sep 29, 2022
filing date -
Sep 29, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring board includes a patterned metal plate made of a metal plate cut in a wiring pattern including lead lines including a connection portion and an insulating layer disposed on a surface of the patterned metal plate. The insulating layer has an exposure opening exposing the connection portion. A method of manufacturing a wiring board includes: a cutting step of providing a patterned metal plate by cutting a metal plate in a wiring pattern, the patterned metal plate including a coupling portion and lead lines including a connection portion, adjacent lead lines being coupled to each other with the coupling portion; a laminating step of providing an intermediate board including the patterned metal plate and an insulating layer on a surface of the patterned metal plate by bonding an insulating material on the surface of the patterned metal plate; and a modifying step of separating the plurality of lead lines from each other by locally removing a portion of the intermediate board in a removal region including the coupling portion.
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