PRINTED WIRING BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Dec 5, 2024
app pub date -
May 31, 2024
filing date -
May 31, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A printed wiring board includes a conductor layer including wirings, a resin insulating layer having openings, a mounting conductor layer including first and second electrodes, first via conductors including a seed layer and an electrolytic plating layer such that the first via conductors connect the first electrodes and the wirings, and second via conductors including the seed layer and electrolytic plating layer such that the second via conductors connect the second electrodes and the wirings. The first electrodes are positioned to mount a first electronic component. The second electrodes are positioned to mount a second electronic component. The first and second via conductors are formed such that the seed layer is covering an inner wall surface of each opening in the insulating layer and has a first portion and a second portion connected to the first portion and having a part of the first portion formed on the second portion.
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Cited Art Landscape
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