Importance

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Abstract

A layered ceramic electronic component mounting structure includes a layered ceramic electronic component mounted on a circuit board. The layered ceramic electronic component includes a layered body including an inner conductor layer and dielectric layers, and first and second outer electrodes located on only two principal surfaces or on only one principal surface of the layered body. The circuit board includes first and second land electrodes. An inside end of the first outer electrode is closer to the second outer electrode and the second land electrode than an inside end of the first land electrode, and an inside end of the second outer electrode is closer to the first outer electrode and the first land electrode than an inside end of the second land electrode.

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First Claim