X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
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United States of America
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Issued Date -
Dec 5, 2024
app pub date -
May 31, 2023
filing date -
May 31, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A method of making a printed circuit board is disclosed. The method includes forming a plurality of layers. The method further includes forming a stack including the plurality of layers such that topmost and bottommost layers of the stack are copper layers and such that inner layers of the stack include resin layers and further copper layers. The method further includes thermocompressing the stack to form a panel such that the resin layers conform to the further copper layers and such that the copper layers bend around a perimeter of the inner layers. The method further includes separating a printed circuit board from the panel such that the printed circuit board's widest extent defines its final width.
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