SWITCHING BOARD AND SOLDERING METHOD THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 5, 2024
app pub date -
Aug 23, 2023
filing date -
Aug 23, 2023
priority date (Note) -
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Abstract
A switching board and a soldering method thereof are provided. The switching board includes a circuit board having a board body and a first metal ring, where the board body has a first surface, and the first metal ring is formed on the first surface and surrounds a periphery of the board body. The switching board further includes a first metal element disposed on the first surface and fastened to the first metal ring by soldering. The switching board has a high pressure resistance and a low leakage rate.
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