PHOTORESIST COMPOSITION, SYSTEM COMPRISING A PHOTORESIST COMPOSITION, METHOD FOR PRODUCING A THREE-DIMENSIONAL STRUCTURE, AND USE OF A PHOTORESIST COMPOSITION IN 3D-PRINTING
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United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Oct 26, 2022
filing date -
Oct 26, 2022
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Abstract
An aspect of the present invention relates to a photoresist composition, comprising: (A) a polymerizable monomer, (B) a photoinitiator, and optionally (C) a polymerization inhibitor, wherein the photoinitiator has at least the following electronic quantum me-chanical energy states: (i) a ground state, (ii) a substantially optically excitable first intermediate state, and (iii) an optically excitable polymerization-inducing state, wherein the first intermediate state is energetically located above the ground state and below the polymerization-inducing state and has a lifetime of about 100 ps to 10 s, and the polymerization-inducing state is optically excitable from the first intermediate state by a single-photon excitation of a predetermined wavelength. Further aspects relate to a system comprising a photoresist composition, a method for producing a three-dimen-sional structure and a use of a photoresist composition in 3D-printing.
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