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Abstract

Provided is a high energy ray-curable composition containing silicon atoms, in which the cured product has high transparency and low dielectric properties, and has low viscosity and excellent workability when applied to a substrate even when the composition is solvent free. The high energy ray-curable composition comprises: (A) 5 parts by mass to 95 parts by mass of a compound having one or more (meth)acryloxy groups and no silicon atoms in the molecule; and (B) 95 parts by mass to 5 parts by mass of a branched organopolysiloxane having one (meth)acryloxy group and no alkoxy group in a molecule, some of the oxygen atoms being substitutable with a divalent alkylene group having no more than 6 carbon atoms. The high energy ray-curable composition contains substantially no organic solvent and the viscosity of the entire composition (measured at 25° C. using an E-type viscometer) is 500 mPa's or less.

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First Claim