VIAS INCLUDING A POROUS ELECTRICALLY CONDUCTIVE MATERIAL AND METHODS FOR FABRICATING THE VIAS
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United States of America
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Dec 12, 2024
app pub date -
Sep 28, 2022
filing date -
Sep 28, 2022
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Abstract
A via includes a substrate and a porous electrically conductive material. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a through-hole extending from the first surface to the second surface. The porous electrically conductive material extends through the through-hole. The porous electrically conductive material includes a first porosity in a central region of the through-hole and a second porosity less than the first porosity proximate the first surface and the second surface of the substrate.
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