COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
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United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Dec 2, 2022
filing date -
Dec 2, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
This copper/ceramic bonded body includes a copper member consisting of copper or a copper alloy and a ceramic member, wherein the copper member is bonded to the ceramic member, an active metal compound layer consisting of an active metal compound is formed on a side of the ceramic member at a bonded interface between the ceramic member and the copper member, microcracks that extend from the bonded interface toward an inner side of the ceramic member are present in the ceramic member, and at least a part of the microcracks are filled with the active metal compound.
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