Importance

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Abstract

The present disclosure provides a substrate processing apparatus capable of adjusting a flow rate of a liquid to be ejected from a nozzle. The substrate processing apparatus according to the present disclosure is a substrate processing apparatus including a nozzle configured to supply a liquid to a substrate, and a liquid supplier configured to supply the liquid to the nozzle, in which the liquid supplier includes a supply pipe which is configured to cause a liquid supply source and the nozzle to be in fluid communication and which has a first pipe constituting a first flow channel from a splitting point to a joining point located downstream of the splitting point and a second pipe constituting a second flow channel from the splitting point to the joining point, a first valve attached to the first pipe, a second valve attached to the second pipe, and a fluid resistance element attached to the second pipe and configured to set a pressure loss of the liquid flowing through the second pipe to be larger than a pressure loss of the liquid flowing through the first pipe.

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First Claim