CONDUCTIVE RESIN COMPOSITION
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Oct 25, 2022
filing date -
Oct 25, 2022
priority date (Note) -
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Abstract
A conductive resin composition contains (a) tin powder, (b) epoxy resin, and (c) organic acid compound, and satisfies requirement (A) and/or requirement (B): (A) the content of the (a) tin powder, relative to the total amount, 100% by mass, of the (a) tin powder, (b) epoxy resin, and (c) organic acid compound, is 90.1% by mass or higher; and/or (B) (d) curing agent is contained, and (d) curing agent includes one or more types selected from (d1) acid anhydride-based curing agents, (d2) thiol-based curing agents and (d3) phenol-based curing agents. The conductive resin composition is intended to demonstrate good conductivity and excellent adhesion with respect to various types of base materials and to be useful as conductive inks, conductive adhesives, circuit connection materials, etc.
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