SPHERICAL SILICA PARTICLES AND RESIN COMPOSITION USING SAME
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Oct 7, 2022
filing date -
Oct 7, 2022
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Abstract
Provided are spherical silica particles that can achieve a lower dielectric dissipation factor when used to fill a resin, and a resin composition using the same. The spherical silica particles (X) are those in which the number of water molecules desorbed from the spherical silica particles (X) when the spherical silica particles (X) are heated from 50° C. to 1000° C. at a rate of temperature increase of 25° C./min. is 0.001-0.010 mmoL/g and in which the specific surface area is 0.1-2.0 m2/g. The resin composition contains the silica particles (X) and at least one resin selected from a thermoplastic resin and a thermosetting resin.
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