SPHERICAL SILICA PARTICLES, AND RESIN COMPOSITION USING SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240417545A1
SERIAL NO

18701790

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Provided are spherical silica particles that can achieve a lower dielectric dissipation factor when used to fill a resin, and a resin composition using the same.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DENKA COMPANY LIMITEDTOKYO 103-8338

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
EBISUZAKI, Takako Tokyo, JP 4 2
FUKAZAWA, Motoharu Tokyo, JP 25 32
KUBOBUCHI, Kei Tokyo, JP 3 0
OKABE, Takuto Tokyo, JP 17 1

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation