MULTI-CIRCUIT HEAT PUMP
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Jun 10, 2024
filing date -
Jun 10, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A multi-circuit heat pump is disclosed. The heat pump comprises an evaporator, a plurality of condensers fluidically connected in series, and a plurality of compressor units configured between the evaporator and the plurality of condensers such that one of the compressor units is fluidically configured between the evaporator and one of the condensers.
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