PHOTONICS CHIP STRUCTURES INCLUDING AN EDGE COUPLER AND A LAYER EXHIBITING AN ELECTRIC-FIELD-INDUCED POCKELS EFFECT
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Jun 14, 2023
filing date -
Jun 14, 2023
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Abstract
Photonics chip structures including an edge coupler and a layer that exhibits an electric-field-induced Pockels effect and methods of forming such structures. The structure comprises a substrate, an edge coupler on the substrate, and a layer including a portion that has an overlapping relationship with the edge coupler. The layer comprises a material that exhibits an electric-field-induced Pockels effect.
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