WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240421471A1
SERIAL NO

18814818

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

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Patent Owner(s)

Patent OwnerAddress
DAI NIPPON PRINTING CO LTD1-1 ICHIGAYA-KAGACHO 1-CHOME SHINJUKU-KU TOKYO 1628001 JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUURA, Daisuke Tokyo-to, JP 29 102
SUZUKI, Koichi Tokyo-to, JP 389 3939
TAKE, Seiji Tokyo-to, JP 35 354

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