CHIP MANUFACTURING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240424705A1
SERIAL NO

18678755

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A chip manufacturing method for manufacturing a plurality of chips by dividing a workpiece with a plurality of intersecting streets set thereon includes a cutting step of cutting a front surface of the workpiece by a cutting blade to thereby form cut grooves along the streets, and then a grinding step of grinding a back surface on the side opposite to the front surface of the workpiece to thereby thin the workpiece to a finish thickness of reaching the cut grooves and to divide the workpiece into the plurality of chips. The cut grooves are formed such that the position of the groove bottom in the thickness direction of the workpiece varies in the width direction of the cut groove, and, in the grinding step, grinding is started from that tip of the groove bottom of the cut groove which is remote from the front surface of the workpiece.

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Patent Owner(s)

Patent OwnerAddress
DISCO CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SUGIYAMA, Tomoaki Tokyo, JP 22 56
YAMAMOTO, Naoko Tokyo, JP 53 519

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