METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN INTEGRATED CIRCUIT PACKAGES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240427232A1
SERIAL NO

18341137

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Abstract

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Systems, apparatus, articles of manufacture, and methods to photolithographically pattern materials in integrated circuit packages are disclosed. An example photolithography mask includes: a transparent substrate, and an opaque material supported by the transparent substrate. The opaque material covers a first area of the transparent substrate. The example photolithography mask further includes an optical filter supported by the transparent substrate. The optical filter covers a second area of the transparent substrate. The second area is distinct from the first area. Both the opaque material and the optical material are spaced apart from a third area of the transparent substrate

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawada, Sho Ogaki, JP 1 0

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